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solder joint

美英

un.锡焊接头；软钎焊
网络焊点；焊点中；焊接连接

solder joint

英-汉网络释义

solder joint

焊点

此而负面效应；一则会因锡量流失而造成焊点(Solder Joint)强度的不足，二则可能会引发盲孔内锡膏助焊剂的气化而吹涨出讨 …

焊点中

（4）吹孔 BLOWHOLES 焊点中（SOLDER JOINT）所出现的孔洞，大者称为吹孔，小者叫做针孔，皆由膏体中的溶剂或水分 …

焊接连接

阀门术语和管线符号 ... 加仑/小时 Gallons Per Hour 焊接连接 Solder Joint 材料清单 Bill of Material ...

焊接接缝

solder中文 ... - solder fusing 焊料熔化; solder joint 焊接接缝 solder mask 焊接淹模 ...

焊点少

...5 C/W ‧接触面积大 ‧结构简单 ‧厚度薄 ‧焊点少(solder joint) 可靠度高 ‧热阻系數低：＜1℃/W 光学 ‧多焦点发光无法聚焦於同一 …

焊点多

...基板散热 ‧热传导路径小,且结构较厚层數较多 ‧焊点多(solder joint) 可靠度差 ‧热阻系數高：6~15 C/W ‧接触面积大 ‧结构简单 ‧ …

例句：

Subsequent inspection under magnification identified three solder joint which appeared to have melted and resolidified (see below).

接续的显微镜检查发现，有三处焊接点似乎已被熔损并固化。

2-D X-ray cannot be used on double-sided boards unless each solder joint is in a unique location relative to the opposite side of the board .

第2 ，除非每焊剂联接在一个独特的地点相对委员会的反面 X 射线在两面的委员会不可能使用。

The experiment results show that there is linear relationship between the solder joint creep damage and its resistance changes .

研究表明，焊点的蠕变损伤与其电阻变化存在着线性关系。

One of the best predictors of resultant solder joint integrity is the volume of solder paste that was applied earlier in the process .

最佳预示所生成的焊点完整性的因素之一，是组装过程起始施加的焊膏量。

Saponifier formulations, without proper inhibitors , may attack some metal surfaces, resulting in a dull solder joint.

皂化剂中所含成分，若不采用适当的抑制剂，将会侵蚀金属表面，造成焊点钝化。

There are magnetic leakage inside tube with a strong magnet . Make use of small signal can intersect position of solder joint.

它是利用管道外面的强磁场在管道内形成的漏磁场来产生定位信号。

The board defect of the circuit measuring includes two parts : The solder joint defect measuring and measuring of the components and parts .

电路板缺陷检测包括两部分：焊点缺陷检测和元器件检测。

On the basis of this theory , SMT solder joint quality fuzzy diagnosis technology was studied.

以该理论为支持，提出了 SMT 焊点质量模糊诊断技术。

Not only look better, and that it is important that the pads higher accuracy and results in increased solder joint reliability .

不但外观比较好看，便重要的是其焊盘精确度较高，从而提高了焊点的可靠性。

Secondly , the radiance model of the illuminator and the irradiance model of the solder joint are developed .

然后，建立了光源的照度模型以及焊点的反射模型。

The digital processing algorithm suitable to solder joint image of the guided missile half tubes has been pressed.

给出了适合导弹半筒焊点图像的数字处理算法。

c. Solder joint was exposed to excessive vibration of movement during the cooling phase.

在冷却过程，移动时过量的振动造成焊点的裸露

With the change of material and technics in electronic packaging , it brings the problem of solder joint reliability .

由于封装材料与封装工艺的改变，给焊点可靠性带来了一系列相关问题。

Ball valves threaded , socket-welding , solder joint , grooved and flared ends.

球阀螺纹，承插焊接，焊接连接，带槽和扩口连接。

The mechanics of making both the solder joint and the brazing joint are comparatively similar .

进行焊料连接和铜焊连接的方法比较相似。

The solder will be dull looking and, if the gold content in the solder exceeds about 5%, the solder joint will be brittle .

焊点外观将变得暗淡，此外，如果焊料中的金成分超过约 5%时，焊点将会变脆。

No cold solder joint, solder skips and wrong welding of components .

元器件无虚焊，漏焊，错贴。

MSS SP-110 Covers Ball Valves , Threaded, Socket -Welding, Solder Joint, Grooved and Flared Ends.

110 包括球阀，螺纹、承插焊、焊接、卡箍和扩口连接。

Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package

芯片叠层球栅阵列尺寸封装的焊球疲劳寿命预测

Shape Prediction of BGA Solder Joint and Its Reliability Optimization Design

BGA 焊点的形态预测及可靠性优化设计

Reliability study of BGA mixed solder joint under thermal cycle

BGA 混合焊点热循环负载下的可靠性研究

The Statistical Analysis and Optimal Evaluating on Thermal Fatigue Life of CCGA Based on Solder Joint Shapes

CCGA 焊点热疲劳寿命统计分析与评价优化

Effects of thermal cycle parameters and substrate dimensions on solder joint reliability

热循环参数及基板尺寸对焊点可靠性的影响

solder joint

solder joint

焊点

焊点中

焊接连接

焊接接缝

焊点少

焊点多

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