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BGA

网络球栅阵列(Ball Grid Array)；球栅阵列封装；闸球阵列封装

BGA

网络释义

BGA

球栅阵列(Ball Grid Array)

球栅阵列(bga) .doc 中文 198 15 芯片封装技术知多少 .doc 中文 25 BGA焊接的基本资料（光盘）市场价： — 商城价：￥100会 …

球栅阵列封装

叫球栅阵列封装（BGA）。BGA芯片节约空间，虽然引脚多，但引脚间干扰较小，适合内部结构复杂的大型芯片。

闸球阵列封装

占闸球阵列封装（BGA）成本达三成至四成，且目前日月光、矽品等一线业者BGA产能利用率又达满载，为了反应强劲需求及 …

球阵列封装(Ball Grid Arrays)

因应球阵列封装(BGA)紧缩的空间需求下而开发了盲孔设计在焊垫内的技术。在可靠的盲孔填孔之下，可在高密度的电路板设计 …

球闸阵列封装

球闸阵列封装（BGA）使它非常适合应用于集成的解决方案中，同时也增强了设备对震动的机械抵抗力性能，从而增加了这些 …

例句：

The BGA program can be described as a time-contingent increase in activities from baseline toward predetermined goals .

BGA 计划可被描述为按时间将活动时间从基线提高到预定目标。

This can cause deformation of the BGA-balls when some of the material in the ball flowing into the via .

这可能会导致变形的 BGA 球时的一些材料在球流入通过。

This section contains the top- view illustrations and pin assignments for applicable BGA package types .

适用 BGA 封装类型的项视详图和引脚分配。

Flexible formed BGA Repair Workstation with option preheater , working stand and soldering station.

灵活选配预热台，工作台架和焊台，可组成 BGA 返修系统。

BGA rework station development & manufacturing .

研发生产 BGA 返修台。

Heating is not good, some area's temperature is not enough , or it's too late to remove the BGA.

加热不均匀，局部地区温度不够或卸芯片不及时。

We provide the welding tools , repair tools , fume extraction and BGA repair center .

我们提供的产品主要分焊接工具，返修工具，空气净化系统和 BGA 专用返修站。

Must have broad experience with PCBA rework including BGA's and small SMT components (0201, etc. ).

拥有丰富的 PCBA 返工经验，包括 BGA 和小 SMT 器件的返工。

Unique a 3 segments' temperature curve program achieves a steady heat rising and good protection of BGA component.

独设三段式温度曲线程序，实践分段升温控制，令 BGA 得到妥贴的保护。

It is ideal for cleaning thru hole , BGA and SMT designs, and rinsing residues from connectors .

它是清洁孔洞，BGA 和 SMT 设计的理想清洁剂，还可以清洗连接器的残留物。

BGA problem is the appearance after reflow inspection .

BGA 的问题是回流焊后的外观检查。

Very few operators in the BGA market have the scale to overhaul their own engines .

在公务、通用飞机市场，只有极少数的运营商拥有发动机大修能力。

Laser cut trumpet type reballing steel plate and BGA stencil helps precise positioning and easy BGA reballing .

激光刻割喇叭型植锡钢片配合 BGA 定位模板，准确定位及 BGA 植锡更容易。

That was ahead of the 816 billion euros ($1. 17 trillion ) forecast for Germany by its foreign trade organization, BGA.

这一数据超过了德国自己的对外贸易机构预测的 8160亿欧元（1.17万亿美元）出口额。

Small component around BGA will never be removed because the temperature is lower than the melting point .

在此状态下，焊锡尚未熔化，不会影响周边靠得较近的元件。

Melt the solder ball to remove the BGA.

使焊球熔化以取下芯片。

Shape Prediction of BGA Solder Joint and Its Reliability Optimization Design

BGA 焊点的形态预测及可靠性优化设计

Mechanical Test on Reliability of Lead-free BGA Assembly and Microstructure Analysis of Soldering Interface

无铅 BGA 封装可靠性的跌落试验及焊接界面微区分析

Reliability study of BGA mixed solder joint under thermal cycle

BGA 混合焊点热循环负载下的可靠性研究

Three dimensional computer aided design for BGA semiconductor packaging machine

BGA 植球机三维计算机辅助模块化设计

BGA Enters Mainstream of the Contemporary Assembly Technology

BGA 技术成为现代组装技术的主流

Effect of Geometrical Nonlinearity on Warpage Prediction of Matrix Stacked Die BGA During Assembly Process

集成工艺中叠片 BGA 阵列翘曲的几何非线性预测分析

Vision inspection technique and application of full-automatic BGA mounting machine

BGA 全自动植球机视觉检测技术及应用

Optical BGA Packaging Technology for high-speed Optoelectronic modules

用于高速光电组件的光焊球阵列封装技术

BGA

BGA

球栅阵列(Ball Grid Array)

球栅阵列封装

闸球阵列封装

球阵列封装(Ball Grid Arrays)

球闸阵列封装

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