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焊锡

na.tin solder; soldering tin
网络tin soldering; Solders; SOLDER BAR

焊锡

英-汉网络释义

焊锡

na.

1.soldering tin; tin solder

1

Most people did not have pewter plates , but , had trenchers, a piece of wood with the middle scooped out like a bowl .

大多数人没有焊锡盘子，而用木制食盘，即把一块木头当中挖空成碗状。

2

Very low leakage current , compact , easy to use power entry filter with fast on tabs or solder terminals .

低漏电流，小巧，端子嵌入或焊锡，方便安装和使用。

3

They were made from a wrought-iron sheet bent into a cylinder and joined along the seam with solder containing more than 90 percent lead.

这种罐是由精制铁皮卷成圆筒而成，切口的缝由铅含量达 90%以上的焊锡来焊接。

4

The fillet not feathering into the surface to be bonded . The wetting will be greater than 90 degrees .

焊锡未能平顺的展延到焊接物件的表面，其焊角将大于 90 度。

5

All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program.

我们制造焊膏所使用的焊锡粉是在惰性气体和严格质量控制之下制成的。

7

8

Made use of the soldering technique, the tube with water channel is covered up in the liquid cooled cold plate .

通过使用焊锡设备把排水管道隐蔽在液体冷却板下面。

9

The minor lead would be found in lead-free solder rods after using them, then it makes the lead contaminant for the electronic components .

在无铅焊锡棒材上使用后都会发现含有少量的铅，而后会对对其电子元件造成铅污染。

10

If you can't find one lying around your dad's workbench , the local hardware store sells them for a few bucks apiece.

如果在你父亲的工作台上没有发现这样一个焊锡盒，那么当地的五金商店可能有售。

12

the oxidation of tin . The oxide on the surface of solders can prevent re-oxidation of solders .

焊锡表面的氧化物可防止焊锡再氧化，因此，不必经常清除浮渣。

14

The higher the temperature is , the bigger the stirring flow of the solder surface is, the more the scum there will be.

温度越高及焊锡表面的搅流越大，形成的浮渣越多。

15

Glass in cathode ray tubes, electronic parts , fluorescent lights , specific alloy, soldering tin for particular use, electronic ceramic, etc.

阴极射线管的玻璃，电子零件，荧光灯，特定合金，特定用途之焊锡，及电子陶瓷等。

17

Do not clip probe to hot parts , e. g TO-220 metal plate, or components lead that are being soldered.

探头不要接触热的部位 ﹐例如 ﹐TO-220 金属板 ﹐或正在焊锡中的零件脚。

19

The main difference when using tin - silver - copper as the paste alloy will be the peak temperature .

将锡 -银 -铜作为焊锡膏合金时的主要差别在于峰值温度。

20

sensor with a special wax coating , applied to lead-free solder .

传感器附有特殊蜡涂层，适用于无铅焊锡。

22

II Abstract The electromigration of solder at solid state was studied in the past, but it was not discussed at liquid state .

I 在以往焊锡的电迁移研究中，探讨对象都是固态焊锡，而液态焊锡是未被探讨的。

23

Koki has developed a series of high performance no-clean solder pastes, which have been proven to ensure excellent soldering quality .

些含铅、免清洗焊锡膏系列产品以其高性能保障了该产品卓越的焊接品质。

25

Solder balls are spheres of solder that remain after the soldering process. Solder balls violate minimum electrical clearance.

焊锡球是焊接后形成的呈球状焊锡。

27

The latest version of our Lead free cored wire provides excellent workability .

最新的无铅带芯焊锡线具有优良的工作能力。

28

What are the main qualification tests for using lead-free solder paste ?

使用无铅焊锡膏的主要评选测试有哪些？

29

The utility model has the advantages of saving guide wire and soldering tin , reducing production cost , and improving labor productivity.

节约了导丝和焊锡，降低了生产成本，提高了劳动生产率。

30

The present invention is lead-free soldering tin technology , and relates to soldering technology of electronic device and element.

一种无铅焊锡技术，涉及电子元件及器件用焊接用焊锡技术。

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