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倒装焊

网络Flip Chip; Flip Chip Bonding; FCOB

倒装焊

倒装焊

倒装焊

Flip Chip

倒装焊(flip chip)已成为芯片焊接的首选工艺，其微小的互连焊点是由Sn的固溶体、共晶组织和金属问化合物(IMC)组成的复杂结 …

Flip Chip Bonding

有三种方式实现内部连接：倒装焊（Flip Chip Bonding）、载带自动焊(TAB －Tape Automated Bonding) 和引线键合(Wire Bon…

FCOB

...氮化硅双层膜结构的技术方案,并将该技术应用于先进的倒装焊(FCOB)封装的水汽敏感性研究。

FCB Flip Chip Bonding

有关半导体材料及封装 -... ... FC Flip Chip 倒装片法 FCB Flip Chip Bonding 倒装焊 FCOB Flip Chip on Board 板上倒装片 ...

fIip-chip

...冶金研究所,上海 200050)摘要: 本文给出了倒装焊(fIip-chip)焊点形态的能量控制方程,采用 Surface EVoIV...

1

Finally, the application prospects of microwave flip -chip bonding technology is suggested and discussed .

随着应用频率的提高，微波芯片与基板间的互连更多地采用了倒装焊。

2

The most potential low cost flip chip bumping method.

最具前景的低成本倒装焊凸点制备方法

3

The influence of underfill and its material models on the reliability of flip chip package under thermal cycling

底充胶及其材料模型对倒装焊热循环可靠性的影响

4

The Failure Study of Interface Delamination in Flip-chip Micro-electron Packaging

倒装焊微电子封装中填料分层开裂失效研究

6

flip chip bonding technology used in modern micro - photoelectron package

现代微光电子封装中的倒装焊技术

7

The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package

倒装焊微电子封装结构参数的概率设计

8

Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling

固化残余应力对倒装焊底充胶可靠性的影响

9

Flip Chip Assembly Hybrid Optoelectronic Integrated RCE Photo-detector Arrays

倒装焊组装的光电混合集成 RCE 探测器面阵

10

Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint

低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响

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