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锡球

锡球

锡球(solder ball); 复合金线; Indium锡膏; Eunow 锡膏; 助焊剂; 清洗剂; 有机保护剂/O.S.P; 主营行业: 焊膏; 助焊笔; 焊丝; 助焊...

外观缺点定义_质量吧_百度贴吧 ... 31. 导线未焊( Conductor not solder) 32. 锡球( Solder Balls) 33. 桥接( Bridge) ...

PCBTN.COM-专业技术-SMT回流焊工艺中英文对照 ... Spattering（飞溅） Solder Balling( 锡球) White Residue（白色残留物…

植锡球(BGA) 附料：目录 MSDS 水溶性助焊膏 (五金专用附料) 目录 MSDS IC 厂专用附料：目录 MSDS 二极管、三极管引脚 …

如何焊接电子元件 ... 桥锡 BRIDGING # # # # 锡球 BALLING # # # # # 短路 SHORTS # # # ...

　　对于许多倒装片应用，锡球(solder bump)的尺寸通常在0.015"以下。小至0.004"的间距(pitch)已经开始在越来越多的先进开发实 …

锡球(Solder beading)：通常，是由于焊盘太靠近，过大的焊盘和过多的锡膏印在单个焊盘上，印刷不干净或以高速贴装0201、0…

Solder Balling is recognized by numerous tiny solder balls trapped along the peripheral edge of the flux residue after reflow.

Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.

This could cause a variety of solder defects , ranging from solder balling to non-wetting to damaged devices to voiding to charred residues.

EPBGA model consists of seven parts , they are heat spreader, molding compound, chip, substrate, thermal vias , solder ball and PCB board .