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键合

na.bonding; interlinking; linkage
网络Wire Bonding; Die bonding; SDB

键合

英-汉网络释义

键合

bonding

其实键合(bonding)主要分三类：金属键(metalic bond)、离子键(ionic bond)、共价键(covalent bond)。这些键合也可以形成四种 …

linkage

物理专业词汇英语翻译(E-L) ... linearly polarized light 线偏振光 linkage 键合 linkage force 键合力 ...

Wire Bonding

它也被称为继键合(Wire Bonding)、TAB和倒装芯片(FC)之后的第四代封装技术。3D封装的主要优势为：具有最小的尺寸和重量…

Die bonding

晶片键合（Die Bonding）用银（Ag）膏，将展出导热率实现25W/mK、可代替焊锡的Ag膏以及LED用Ag膏。而热硬化性树脂上…

linking

化学专业词汇_汉英_ ... liquid insulator 液体绝缘体 linking 键合 liquid ion exchanger 液体离子交 ...

SDB

硅直接键合(SDB)技术在新型电力电子器件应用中的新进展硅片键合强度测试方法的进展 MEMS中的静电一热键合技术单片集 …

例句：

The shear force reading of a ball bond must be correlated with its ball diameter for proper assessment of its ball shear strength .

剪切力度应与金球直径相关（金球直径的设定应考虑到键合点需要承受的力度）。

Normally, we use the word bond to describe the linkage between a particular pair of atoms .

通常我们用键这个词来描述指定的一对原子之间的键合。

The bond in which the linkage pair of electrons are provided by one of the bonding atoms .

一个键合原子用以联结一对电子的键。

Newly published research reveals how one broadly neutralizing HIV antibody actually uses part of the sugary cloak to help bind to the virus .

新近的研究显示了一个广泛中和的 HIV 抗体实际是怎样用部分多糖外壳去键合病毒的。

Crosslinkers having a covalently bonded phosphorous atom, the phosphorous atom having at least one covalently bonded oxygen atom .

具有共价键合的磷原子的交联剂，所述磷原子具有至少一个共价键合的氧原子。

Experimental results can be used to model a real ultrasonic bonder and optimize its functions.

这些均有助于键合机换能系统的工艺建模和优化。

The stationary phase is coated on the wall of capillary , whereas the mobile phase moves through the column propelled by electroosmosis .

它是在毛细管管壁涂布或键合固定相，以电渗流驱动流动相的一种色谱分离模式。

Die bonding is one of the important processes to manufacture the IC components , which must make in the die bonder .

键合是 IC 元件生产的重要封装过程或工序，需要在芯片键合机上完成。

Wire bonding today is used throughout the microelectronics industry as a means of interconnecting the chips, substrates and output pins .

引线键合技术是现代微电子封装中常用的一种技术。

Wire Pull Testing (WPT) , or bond pull testing , is one of several available time-zero tests for wire bond strength and quality .

拉线测试（WPT ），或称键合力度拉扯测试，是评价金线键合力度与质量的有效方法之一。

The article analyzed the relations between the bonding pressure and the bonding strength through the experiment .

通过实验，研究了键合强度与键合压力间的关系。

The toughening efficiency was related to morphology, chemical bonding and epoxy resin matrix deformation of the system .

增韧效果与体系的相态结构、化学键合和环氧基体的延展性有关。

The process uses an organometallic complex with at least one non-bridged indenoindolyl ligand bonded to M.

该方法使用具有至少一个键合到 M 的非桥联茚并吲哚基配体的有机金属配合物。

The paper analyzed the relations between the bonding pressure and the bonding strength through the experiments .

通过实验研究了键合强度与键合力之间的关系。

The nature of the bonded phase is an important parameter for determining the separation properties of the chromatographic system .

键合相性质是确定色谱系统分离性质的重要的参数。

Wirebonding, clean room , and plastics have been established in Continental Tianjin to widen the product portfolio.

无尘洁净室，金线键合等生产线的建立也进一步扩大了天津工厂的产品领域。

键合

键合

bonding

linkage

Wire Bonding

Die bonding

linking

SDB

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