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电子封装材料

网络IC encapsulation materials; Electronic Packaging Materials; electronic encapsulation materials

电子封装材料

电子封装材料

电子封装材料

IC encapsulation materials

可与产业界合作项目T... ... 4. 高压绝缘材料。 High voltage insulation materials 1. 电子封装材料。 IC encapsulation materials ...

Electronic Packaging Materials

什么意思_英语electronic... ... ELECTRONIC CERAMIC MATERIALS 电子陶瓷材料 Electronic Packaging Materials 电子封装材 …

electronic encapsulation materials

什么意思... ... Electronic Packaging Materials 电子封装材料 electronic encapsulation materials 电子封装材料 ...

2

Shanxiweihua Electric Encapsulation Material CO. , LTD.

陕西伟华电子封装材料有限公司。

3

A brief review of the research and development of the traditional packaging materials is given.

对传统金属电子封装材料的研究开发现状进行了简单评述。

5

High performance polyphenylene sulfide materials for electronic encapsulation

高性能聚苯硫醚电子封装材料

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Modern Microelectronics Packaging Materials and Packaging Technology

现代微电子封装材料及封装技术

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Present Status and Progress in Study of Electronic Packaging Materials

电子封装材料的研究现状及进展

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Microstructures and properties of Si -Al alloy for electronic packaging prepared by spray deposition technique

喷射沉积硅铝电子封装材料的组织与性能

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New Spray Formed Light Weighted Si-Al Electronic Packaging Materials with Low Thermal Expansion and High Heat Conducting

新型喷射成形轻质、高导热、低膨胀 Si-Al 电子封装材料

10

Application of the liquid rubber in the electronic encapsulation material

液体橡胶在电子封装材料中的应用

13

Toughening methods of epoxy resins for electric encapsulation materials

电子封装材料用环氧树脂增韧研究进展

14

Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

等离子喷涂 W-Cu 电子封装材料的组织与性能

15

Research Progress of Lead-free Solders and Solder Joint Reliability in Electronic Packaging

无铅电子封装材料及其焊点可靠性研究进展

17

Current Status of Research on Electronic Packaging Materials

电子封装材料的研究现状

18

Status and Prospects of New Materials for Electric Packing

新型电子封装材料的研究现状及展望

19

Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

压制压力对 Si-Al 电子封装材料性能的影响

20

Research and Development of High Performance Epoxy Molding Compounds

高性能环氧树脂电子封装材料的研究与发展现状

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