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封装材料

网络Packaging Materials; Package Materials; Encapsulation

封装材料

网络释义

封装材料

Packaging Materials

　　半导体材料包括半导体制造材料(Wafer Fab Materials)和封装材料(Packaging Materials)两类，如表10所示。根据SEMI的数据，…

Package Materials

封装材料 (Package Materials) 二、系统光源 (System Light Source) 1. 紫外线曝光 (UV Curing） 2.

Encapsulation

太阳能电池板... ... 封装方式 Encapsuletion Method 封装材料 Encapsulation 长度 Length 900mm ...

package material

长工作距离准直器-... ... 储存温度 Storage Temperature 封装材料 Package Material 光纤类型 Fiber Type ...

Encapsulation Material

锦州旭龙太阳能科技有限公司 ... 厚( Thickness) 封装材料( Encapsulation Material) 工作温度( Operating Temperature) ...

packaging material

封孔材料,sealing... ... ) encapsulating material 灌封材料 ) packaging material 封装材料 ) sealing material 封接材料 ...

epoxy molding compound

Process Engineer着重于进行试验(DOE)，测试封装材料(epoxy molding compound)和模具设计，改进封装应用的工艺及设计。 …

例句：

The paper puts forward a kin of numerical controlled laser cutting technique applied to wipe off encapsulation of chip.

本文研究了一种用于去除封装材料的数控精密激光切割技术。

Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures .

对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。

With the change of material and technics in electronic packaging , it brings the problem of solder joint reliability .

由于封装材料与封装工艺的改变，给焊点可靠性带来了一系列相关问题。

Studies show that water vapor quickly permeates plastic packaging material .

研究证明水蒸汽能迅速渗入塑料封装材料。

Furthermore , encapsulating with silicone stead of epoxy resin , the degradation coefficient can be reduced to 0 . 000113 .

并且改用硅脂作为封装材料，衰减系数可进一步减小为 0 .

Packaging material is in use for filling up inside the convex part .

该封装材料用于填充该凸部的内部。

Shanxiweihua Electric Encapsulation Material CO. , LTD.

陕西伟华电子封装材料有限公司。

A brief review of the research and development of the traditional packaging materials is given.

对传统金属电子封装材料的研究开发现状进行了简单评述。

It is imperative to develop a new kind encapsulation material .

故研发一种新型封装材料势在必行。

Dai Nippon business card printing and membership card which will provide on making this is offers nmsio and back the whole service .

大日本制卡和会员卡制作此次将提供的是背面封装材料和背板合为一体的服务。

More than 40 kinds of overlay coating stuff and their technics were studied and tested for many times.

研究测试了 40 多种光纤光栅封装材料的配方及封装工艺。

High performance polyphenylene sulfide materials for electronic encapsulation

高性能聚苯硫醚电子封装材料

Modern Microelectronics Packaging Materials and Packaging Technology

现代微电子封装材料及封装技术

Present Status and Progress in Study of Electronic Packaging Materials

电子封装材料的研究现状及进展

Electronic Packaging Technology and Polymer-based Composite Packaging Materials

高导热聚合物基复合封装材料及其应用

Microstructures and properties of Si -Al alloy for electronic packaging prepared by spray deposition technique

喷射沉积硅铝电子封装材料的组织与性能

Electronic packaging material system for semiconductor packages

半导体用封装材料系统

New Spray Formed Light Weighted Si-Al Electronic Packaging Materials with Low Thermal Expansion and High Heat Conducting

新型喷射成形轻质、高导热、低膨胀 Si-Al 电子封装材料

Application of the liquid rubber in the electronic encapsulation material

液体橡胶在电子封装材料中的应用

Package Materials and Related Issues of IT

电子封装材料用环氧树脂增韧研究进展

Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

等离子喷涂 W-Cu 电子封装材料的组织与性能

封装材料

封装材料

Packaging Materials

Package Materials

Encapsulation

package material

Encapsulation Material

packaging material

epoxy molding compound

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