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多层印制板

网络multilayer printed board; multilayer board; mulitlayer printed board

多层印制板

网络释义

多层印制板

multilayer printed board

SMT常用术语&中英文对... ... 双面印制板﹕ double-sided printed board 多层印制板﹕ multilayer printed board 电烙铁﹕ Iro…

multilayer board

PCB英汉词典... ... multilayer carrier tape / 多层载体带 multilayer board / 多层印制板 multifoot LID / 多脚无引线倒装管壳 ...

mulitlayer printed board

印制电... ... 双面印制板 Double-side Printed Board 多层印制板 Mulitlayer Printed Board 特性阻抗 Characteristic impedance ...

SMPB Sequential Multilayer Printed Board

谁有有关SMT的... ... SMPB Sequential Multilayer Printed Board 多层印制板 SMOBC Solder Mask on Bare Copper 裸铜上印阻 …

multilayer printed circuit board

MPCB

表面安装器件（SMD）、多芯片组件（MCM）、多层印制板 （MPCB）等技术在电路系统中的应用使得器件安装密度不断提高 …

Multilayer Print Board

...ouble Sided Print Board） 多层印制板（Multilayer Print Board）（2）根据PCB所用基板材料划分刚性印制板（Rigid Print B…

例句：

Double sided and Multilayer Boards Drilling , Press and Mechanical drilling supporting service .

双面多层印制板、专业钻孔、压合、数控钻机技术服务。

Printed boards . Part 4 : rigid multilayer printed boards with interlayer connections. Sectional specification.

印制板 .第 4 部分：层间连接的硬质多层印制板 .分规范

Specification for mass lamination panels (semi-manufactured multilayer printed boards )

预制内层层压板规范（半制成多层印制板）

The analysis of the plating defect of plated through hole of the multilayer printed circuit board and countermeasure

多层印制板金属化孔镀层缺陷成因分析及相应对策

Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

多层印制板用芯板结构选择导则

System of quality assessment - Sectional specification - Rigid multilayer printed boards

质量评估体系 .分规范 .刚性多层印制板

Specification for flex-rigid multilayer printed boards with through connections

有贯穿连接的刚挠多层印制板规范

Solder Mask Protective Technology in Production of Multilayer Printed Circuit Boards

多层印制板生产中非金属材料的保护技术

Discuss About the Process Quality Control Technology of Plated Through Hole of the Multilayer Printed Circuit Board

多层印制板孔金属化过程品质控制技术探讨

Tin Plating Protective Technology in Production of Multilayer Printed Circuit Board

多层印制板生产中的电镀锡保护技术

Solder Coat Protective Technology in Production of Multilayer Printed Circuit Board

多层印制板生产中的表面金属材料保护技术

Test method for insulation resistance between layers of multilayer printed boards

多层印制板层间绝缘电阻测试方法

Test method for insulation resistance within inner layers of multilayer printed boards

多层印制板内层绝缘电阻测试方法

Specification for Resin Impregnated Fabric (Preimpreg ) for Multilayer Printed Boards

多层印制板树脂灌注纤维（浸渍）的技术要求

Specifications for Base Materials for Rigid and Multilayer Printed Boards

刚性及多层印制板用基材规范

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

多层印制板金属基底覆以其他金属薄层的技术要求

The Technology of Laminating of Multilayer Printed Circuit Board and the Methods of Decreasing the Warp

多层印制板层压工艺及减少翘曲产生的方法

Specification for flexible multilayer printed boards with through conections

有贯穿连接的挠性多层印制板规范

Study of the Void PTH of the Multilayer PCB

多层印制板金属化孔镀层空洞研究

Specification for Base Materials for Rigid and Multilayer Boards

刚性及多层印制板基材特性规范

Designing for High Performance Multilayer PCBs

满足高性能多层印制板的设计

Quality Control Of The Project Datum Of The Multilayer PCB

多层印制板工程资料的质量控制

Results of Multilayer Tests Program Round Robin

多层印制板联合试验计划结果

多层印制板

多层印制板

multilayer printed board

multilayer board

mulitlayer printed board

SMPB Sequential Multilayer Printed Board

multilayer printed circuit board

MPCB

Multilayer Print Board

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